General

Spur Electron is a leading UK supplier of proactive obsolescence solutions and counterfeit detection and mitigation services. We have extensive laboratory facilities able to provide in depth analytical services for the entire range of electronic components. These services include Destructive Physical Analysis (DPA), Constructional Analysis (CA) and Failure Analysis (FA). Within these services we perform Radiographic Inspection, Materials Analysis (including analysis of pure-tin and tin-lead), Microsectional Analysis, Scanning Electron Microscope (SEM), etc. In addition to the above we offer procurement, screening, test, long term storage, manufacturing and assembly.

Engineering

The Engineering Team at Spur Electron offers essential component engineering support, ranging from sourcing obsolete components, through high reliability procurement and screening to full scale centralised procurement management. The department has the ability and means to design, assemble, screen, test and deliver the full range of EEE components. Key services include Obsolete Component Management, World Wide Procurement, Screening and Up-screening, Electrical Test, Environmental Test, Mechanical Test, Lot Acceptance Test, Re-life, Radiation Assessment and Testing, as well as Off-site services such as Pre-Cap, Final Source Inspection, Buy-off and Data Review.

Procurement

Spur Electron have been performing the procurement of components world-wide for over 20 years. Customer requirements range from procurement for single specialised components to full centralised component procurement for major programmes. Key Services include review of preliminary bill of materials, assessment of declared component list, preparation and negotiation of procurement specifications, management of manufacturers, compliance with export requirements (ITAR), component inspection, test and data review.
Laboratory Services
Our laboratory staff combine expert component processing and technical knowledge with specialist equipment skills to offer a wide range of component assessment services. Spur Laboratory Services routinely perform Destructive Physical Analysis (DPA) carried out to meet ESA, NASA, US-MIL, Spur internal or customer specific standards on all EEE parts. Constructional Analysis and Failure Analysis are also performed within the laboratory on a regular basis for Commercial, Military and Space customers. Key services and equipment available in the laboratory include Scanning Electron Microscope (SEM), Materials Analysis using EDX, Fine and Gross Leak detectors, PIND testing and Microsectioning equipment. An image archiving system allows storage of numerous pictures at each stage of the analysis, creating a complete complex library of detailed images which can be referred to at a later date as required.

Manufacturing

The Manufacturing department has been established to provide a solution to the development and manufacture of electronic assemblies, sub-systems and complete rack systems built primarily for Military and Space customers.
Within the facility is a class 10,000 cleanroom where the environment has positive pressure and is air-conditioned with temperature and humidity control. Our Manufacturing capability extends from procurement of all parts, assembly of components on to printed circuit board, testing of the assemblies and conformal coating as well as the wiring of racks and enclosures.
The company has recently invested in the latest technology auto assembly equipment. The new line comprising of an auto screen printer with full vision and all parameters including printing speed, squeegee pressure, lift off speed and printing stroke can be programmed from the windows based user interface.
An auto-placement machine capable of placing 4,600 components per hour including dual placement heads, 2 CCD camera’s for full vision alignment, 0.001mm resolution, intelligent feeders with 132 feeder positions provides quick feeder change without interruption to placement, off-line programming, and optimisation.
The vapour phase solder machine was selected to handle both lead-free (230 Deg C) and tin/lead (200 Deg C) solder profiles. These re-flow temperatures cannot be exceeded therefore protecting the assembly from any over heating.
Excellent solder joints are obtained from the closed loop process that precludes oxygen from the soldering with accurate temperature profiles obtained for every type of board.